簡介
B4C
Amptek 宣佈推出碳化硼 （B4C） 用於 Amptek 的 FAST SDD® 和 SiPIN 探測器的視窗。該產品是多年努力的結果，旨在為最終使用者和 OEM 製造商提供標準鈹 （Be） 箔的高性能視窗替代品。
我要諮詢Amptek 宣佈推出碳化硼 （B4C） 用於 Amptek 的 FAST SDD® 和 SiPIN 探測器的視窗。該產品是多年努力的結果，旨在為最終使用者和 OEM 製造商提供標準鈹 （Be） 箔的高性能視窗替代品。
產品優勢
- 在廣泛的能量範圍內，傳送效率與 Be 箔相當，典型用於手持式和桌上型 XRF 應用。
- 從鈹視窗切換到 B4C 視窗時，儀器的結果不會受到太大影響。
- 可用於以前使用過鈹視窗的大多數應用。
- 所]使用是無毒材料讓您在安裝和使用過程中無後顧之憂。
- 對鈹的潛在健康危害和接觸鈹的擔憂對這些視窗來說不是問題。
- 與典型的鈹箔相比，厚度變化更小。
- 鈹視窗成型製程允許視窗厚度有有一定程度的變化。 然，B4C 視窗的半導體製造過程受到嚴格控制，因此視窗厚度更加一致。
- 原始設備製造商更喜歡這種方式，因為即使在較低的能量下，他們也能期望探測器與探測器之間有相同的傳送效率。
- 如果視窗厚度更接近標示值，則可在定量計算中更好地建模。
產品應用
B4C 視窗的穿透率可與標準的 ⅓ mil ( 密耳 ) 和 ½ mil ( 密耳 )的Be 視窗媲美。 最初發布的產品採用厚度為 3.5 µm 的均勻B4C 層，自支撐，無需底層網格。 鋁質外塗層提供接地表面，幫助探測器屏蔽電磁干擾。
一致的厚度
| 新型碳化硼 B4C |
與標準 Be 視窗相比 | ||
| 1/3 mil Be | ½ mil Be | ||
| 厚度 | 3.5 µm | 7.6 µm .0003” |
12.7 µm .0005” |
| 容許偏差 | (-.3/+.3 µm) | (-.0 µm/+5.1 µm) (-.0000”/+.0002”) |
(-.0 µm/+5.1 µm) (-.0000”/+.0002”) |
| 直徑 | 7 mm | 7 mm | |
| 接地 ? | Yes ( 鍍鋁 ) | ||
| 其它塗層 | None | Yes ( 聚對二甲苯 ) | |
| 氦洩漏率 | </= 10e-13 mbar/s | ??? | ??? |
| 工作溫度 | -35 °C to +80° C | -35 °C to +80° C | |
| 堅固性 | 4 英尺跌落測試中 80% 的存活率 | ||
Amptek is announcing the introduction of Boron Carbide (B4C) windows for use with Amptek’s FAST SDD® and SiPIN detectors. The product offering is the result of a multi-year effort to provide end-users and OEM manufacturers with a high-performance window alternative to standard beryllium (Be) foils.
Advantages
- Comparable transmission efficiency to Be foils over a wide energy range, typical to hand-held and benchtop XRF applications
- Results from an instrument will not be greatly affected when switching from Beryllium to B4C windows.
- Can be used in most places where a beryllium window was previously used.
- Non-toxic material provides worry-free handling during installation and use
- Concerns over the potential health hazards of beryllium and exposure are not an issue with these windows.
- Less thickness variation as compared to typical Be foils
- The beryllium window forming process allows a fair amount of variation in window thickness. The tightly controlled semiconductor fabrication process on the B4C windows produces a much more consistent window thickness.
- OEM's prefer this as they can expect similar transmission from detector to detector, even at lower energies.
- Allows for better modeling in quantitative calculations if the window thickness more closely matches the nominal values.
Applications
B4C windows have been designed to provide transmissions comparable to standard ⅓ mil and ½ mil Be windows. The initial product release utilizes a uniform 3.5 µm thick B4C layer, self-supported, without the need for an underlying grid. An aluminum outer coating provides a grounded surface to help shield the detector from EMI.
Consistent Thickness
|
New Boron Carbide B4C |
compared to standard Be windows | ||
| 1/3 mil Be | ½ mil Be | ||
| Thickness | 3.5 µm | 7.6 µm .0003” |
12.7 µm .0005” |
| Tolerance | (-.3/+.3 µm) | (-.0 µm/+5.1 µm) (-.0000”/+.0002”) |
(-.0 µm/+5.1 µm) (-.0000”/+.0002”) |
| Diameter | 7 mm | 7 mm | |
| Grounded? | Yes ( Al coated ) | ||
| Additional coatings | None | Yes ( Parylene ) | |
| He Leak Rate | </= 10e-13 mbar/s | ??? | ??? |
| Operating Temperature | -35 °C to +80° C | -35 °C to +80° C | |
| Ruggedness | 80% survival from 4ft. drop test | ||