The thickness of the non-alloyed and alloyed tin layer on thin copper wires can be measured with high accuracy in a short duration by the electrochemical Analyzer SnLayer.

The coulometric determination of the thickness of the tin layer at the copper wires based on a newly developed procedure: the technique of voltammetry with a multiple potential-ramp.

The total amount of tin as well as the non-alloyed and the alloyed tin-part is detectable in only one measurement.

Applications

• Determination of thickness of tin at copper wires
• Determination of the non-alloyed and alloyed tin layer
• Conductor board manufacture
• Wire and cable manufacture
• Quality management in rolling mills
• Application in metal industry

Advantages

• Complete measurement system for the layer thickness of tin
• Differentiation of non-alloyed and alloyed tin
• Fast analysis
• Typical duration: 8 min (non-alloyed and alloyed tin) < 2 min (non-alloyed tin)
• According to the actual standard regulations
• Automatic procedures
• Customer-friendly handling
• Pre-defined methods for selected wire-types
• Generation of individual methods
• Intuitive software
• Comprehensive statistic module
• Wide dynamic range for various wire-diameters and layer thickness
• High precision of the analysis